Mobile Processor Innovation


Envision the future. Design Reality.

Mobile Processor Innovation aggressively conceptualizes future product ideas incorporating new and advanced technologies and supporting the most computationally challenging algorithms. Focusing on system and chip solutions, the MPI lab accelerates product ideas and creates prototype devices to demonstrate feasibility and execute advanced development for next-generation mobile platforms in the Samsung Galaxy product line.

New, but moving fast, Mobile Processor Innovation has already demonstrated innovations in next-generation mobile imaging architecture and systems. In addition, we are exploring killer mobile applications that will lead to new and enhanced ways of using mobile devices to improve our lifestyles, increase our safety, and immerse us in entertainment. By understanding the next generation of mobile applications, we are able to create, design and prototype the next generation of chips that will support new modes of sensing the environment and powering the computations required by the next generation products.


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1300 E. Lookout Drive
Richardson, TX 75082
Mike Polleyv2

Research Head

Mike Polley

Mike Polley and his team consist of world-class algorithm and system designers, and chipset architects with a passion in creating new technologies for next generation smartphones and wearable devices. 

Prior to Samsung, Mike worked at Texas Instruments for 18 years where he made numerous technical contributions and led teams developing chip and system architectures spanning wireless and wired communications, image and video signal processing, and programmable DSP and embedded hardwired solutions.   Mike served as chief architect of several mobile businesses in TI, including the OMAP application processor business.  He also served as head of the Embedded Signal Processing R&D Lab where his team developed new algorithms and embedded implementations for a wide range of products.  Mike was recognized for his technical accomplishments by election to TI Fellow in 2008.

He received his B.S., M.S., and Ph.D. degrees in electrical engineering from MIT.  He holds 32 U.S. patents on a broad range of products across communications and multimedia systems.

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